stacked dies Malaysia details
Die-stacking generation is likewise called three-dimensional integrated circuits (3-d ics). The idea is to stack more than one layers of integrated circuits (ics) vertically, and join them collectively with vertical interconnections known as stacked dies Malaysia . Three-d integration technologies offer many advantages for ic designs. Such advantages encompassthe guide for the realization of heterogeneous integration, that could result in novel architecture designs; smaller form elements, which results in better packaging density and smaller footprint due to the addition of a third dimension to the conventional dimensional format, and doubtlessly results in a lower price design. Consequently, 3-d integration era is one of the promising answers to conquer the boundaries in interconnect scaling, thereby providing an possibility to keep performance enhancements using cmos generation. Early die-stacking structure effort the three-d integration technology has been an energetic researc